Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods

ABSTRACT

Methods of fabricating semiconductor structures and devices include bonding a seed structure to a substrate using a glass. The seed structure may comprise a crystal of semiconductor material. Thermal treatment of the seed structure bonded to the substrate using the glass may be utilized to control a strain state within the seed structure. The seed structure may be placed in a state of compressive strain at room temperature. The seed structure bonded to the substrate using the glass may be used for growth of semiconductor material, or, in additional methods, a seed structure may be bonded to a first substrate using a glass, thermally treated to control a strain state within the seed structure and a second substrate may be bonded to an opposite side of the seed structure using a non-glassy material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication Ser. No. 61/262,391, filed Nov. 18, 2009, and U.S.Provisional Patent Application Ser. No. 61/286,680, filed Dec. 15, 2009,the disclosure of each of which is hereby incorporated herein in itsentirety by this reference.

FIELD

The present invention generally relates to methods of fabricatingsemiconductor structures and devices using engineered substrates, tointermediate structures formed during the fabrication of semiconductorstructures and devices, to engineered substrates for use in thefabrication of semiconductor structures and devices, and tosemiconductor devices formed using engineered substrates.

BACKGROUND

Substrates that include one or more layers of semiconductor material areused to form a wide variety of semiconductor structures and devicesincluding, for example, integrated circuits (ICs) (e.g., logicprocessors and memory devices), radiation emitting devices (e.g., lightemitting diodes (LEDs), resonant cavity light emitting diodes (RCLEDs),and vertical cavity surface emitting lasers (VCSELs)), radiationabsorbing devices (e.g., optical sensors and solar cells) andswitching/rectifying devices (e.g., power electronic devices). Suchdevices may comprise bipolar junction transistors (BJTs), powermetal-oxide-field-effect-transistor (MOSFETS), thyristors, schottkydiodes, junction field effect transistors (JFETs), insulated gatebipolar transistors (IGBTs) and PIN diodes. Such semiconductor devicesare conventionally formed in a layer-by-layer manner (i.e.,lithographically) on a semiconductor substrate.

Historically, a majority of such semiconductor substrates that have beenused in the semiconductor device manufacturing industry have comprisedthin discs or “wafers” of silicon material. Such wafers of siliconmaterial are fabricated by first forming a large generally cylindricalsilicon single crystal ingot, and subsequently slicing the singlecrystal ingot perpendicularly to its longitudinal axis to form aplurality of silicon wafers. Such silicon wafers may have diameters aslarge as about thirty centimeters (30 cm) or more (about twelve inches(12 in.) or more). Although silicon wafers generally have thicknesses ofseveral hundred microns (e.g., about 700 microns) or more, only a verythin layer (e.g., less than about three hundred nanometers (300 nm)) ofthe semiconductor material on a major surface of the silicon wafer isactually used to form active devices on the silicon wafer.

It has been discovered that the speed and power efficiency ofsemiconductor devices can be improved by electrically insulating theportion of the semiconductor material that is actually used to form thesemiconductor devices from the remaining bulk semiconductor material ofthe substrate. In addition, it has more generally been discovered thatproviding the semiconductor material used to form the semiconductordevices upon a base substrate, comprising one or more materials, allowsfor “engineering” of the properties of the semiconductor material.

As a result, so-called “engineered substrates” have been developed thatmay include a relatively thin layer of semiconductor material (e.g., alayer having a thickness of less than about three hundred microns (300μm)) disposed upon one or more other material, such as, for example,dielectric material (e.g., silicon dioxide (SiO₂), silicon nitride(Si₃N₄), silicon carbide (SiC), silicon (Si) or aluminum oxide (Al₂O₃)).Optionally, the layer of dielectric material may be relatively thin(e.g., too thin to enable handling by conventional semiconductor devicemanufacturing equipment), and the layer or layers of material over whichthe semiconductor material is disposed (i.e., the base substrate) may bethick enough to enable handling of the engineered substrate bymanufacturing equipment.

A wide variety of engineered substrates are known in the art and mayinclude semiconductor materials such as, for example, silicon (Si),germanium (Ge), silicon carbide (SiC), III-V type semiconductormaterials, and II-VI type semiconductor materials.

For example, an engineered substrate may include an epitaxial layer ofIII-V type semiconductor material on a surface of a base substrate, suchas, for example aluminum oxide (Al₂O₃) (which is often referred to as“sapphire”). Using such an engineered substrate, additional layers ofmaterial may be formed and processed (e.g., patterned) over theepitaxial layer of III-V type semiconductor material to form one or moresemiconductor devices on the engineered substrate.

When a layer of semiconductor material is epitaxially grown at elevatedtemperatures upon an engineered substrate, lattice strain may be inducedin the crystal lattice of the layer of semiconductor material. Thestrain in the semiconductor material may result from a lattice parametermismatch between the crystal lattice of the underlying materials of theengineered substrate and that of the semiconductor material being formedthereon (e.g., the underlying material has one or more lattice constantsthat differ from that of the semiconductor material).

In addition, a lattice strain may also be induced in the crystal latticeof the semiconductor material during epitaxial growth at elevatedtemperature due to a difference in the coefficients of thermal expansion(CTE) exhibited by the respective adjacent materials. For example, ifthe underlying engineered substrate has a mean CTE which is greater thanthat of the semiconductor material being grown upon the engineeredsubstrate, the semiconductor material may be grown in a state of tensilestrain. Such a state of tensile strain may increase during the growth ofthe semiconductor material as the layer thickness increases, and mayeventually result in the formation of defects in the semiconductorlayer. Such defects may include, for example, dislocations and cracks.

BRIEF SUMMARY

Embodiments of the present invention may be used to provide layers ofsemiconductor material over engineered substrates having reduced latticestrain, which may enable the formation of relatively thicker layers ofhigh-quality semiconductor material using the engineered substrates. Asa result, embodiments of the present invention may be used to provideimproved semiconductor devices.

In some embodiments, the present invention includes methods offabricating semiconductor structures and devices in which at least oneseed structure is bonded to a carrier substrate using a glass bondinglayer. The at least one seed structure is at least substantiallycomprised by a single crystal of semiconductor material. At least onelayer of semiconductor material may be deposited over the at least oneseed structure at a temperature above a glass transition temperature ofa glass material of the glass bonding layer while the at least one seedstructure is supported on the glass bonding layer.

In additional embodiments, the present invention includes methods offabricating semiconductor structures and devices in which at least oneseed structure is bonded to a first carrier substrate using a glassbonding layer. The at least one seed structure is at least substantiallycomprised by a single crystal of semiconductor material. A secondcarrier substrate is bonded to the at least one seed structure on a sidethereof opposite the first carrier substrate using a non-glassy bondinglayer. The first carrier substrate and the glass bonding layer may beremoved from the at least one seed structure, and the single crystal ofsemiconductor material of the at least one seed structure may beexpanded using the thermal expansion of the second carrier substratewhile heating the at least one seed structure, the non-glassy bondinglayer, and the second carrier substrate. At least one layer ofsemiconductor material may be deposited over the at least one seedstructure on a side thereof opposite the second carrier substrate andthe non-glassy bonding layer while the single crystal of semiconductormaterial is in an expanded state at least partially caused by thethermal expansion of the second carrier substrate.

Additional embodiments of the present invention include semiconductorstructures and devices formed by the methods described herein. Suchsemiconductor structures and devices include, for example, integratedcircuits (ICs) (e.g., logic processors and memory devices), radiationemitting devices (e.g., light emitting diodes (LEDs), resonant cavitylight emitting diodes (RCLEDs), and vertical cavity surface emittinglasers (VCSELs)), radiation absorbing devices (e.g., optical sensors andsolar cells) and switching/rectifying devices (e.g., power electronicdevices). Such devices may comprise bipolar junction transistors (BJTs),power metal-oxide-field-effect-transistor (MOSFETS), thyristors,schottky diodes, junction field effect transistors (JFETs), insulatedgate bipolar transistors (IGBTs) and PIN diodes.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming what are regarded as embodiments of the presentinvention, the advantages of this invention may be more readilyascertained from the description of embodiments of the invention whenread in conjunction with the accompanying drawings, in which:

FIG. 1 is a simplified cross-sectional view of an intermediate structurethat may be formed during embodiments of methods of the presentinvention and that includes a layer of semiconductor material on a firstsubstrate;

FIG. 2 is a simplified cross-sectional view of another intermediatestructure that may be formed by attaching a second substrate to theintermediate structure of FIG. 1;

FIG. 3 is a simplified cross-sectional view illustrating anotherintermediate structure that may be formed by removing a portion of thelayer of semiconductor material and the first substrate from theintermediate structure of FIG. 2;

FIG. 4A is a simplified cross-sectional view of another intermediatestructure that may be formed by patterning the remaining portion of thelayer of semiconductor material on the intermediate structure of FIG. 3;

FIG. 4B is a top plan view of the intermediate structure shown in FIG.4A;

FIG. 5 is a simplified cross-sectional view of another intermediatestructure that may be formed by growing additional semiconductormaterial over the patterned semiconductor material on the intermediatestructure of FIGS. 4A and 4B;

FIG. 6 is a simplified cross-sectional view of another intermediatestructure that may be formed by attaching a third substrate to theintermediate structure of FIGS. 4A and 4B;

FIG. 7 is a simplified cross-sectional view of another intermediatestructure that may be formed by removing the second substrate from thepatterned semiconductor material and the third substrate of theintermediate structure of FIG. 6; and

FIG. 8 is a simplified cross-sectional view of another intermediatestructure that may be formed by growing additional semiconductormaterial over the patterned semiconductor material on the intermediatestructure of FIG. 7.

DETAILED DESCRIPTION

The illustrations presented herein are not meant to be actual views ofany particular semiconductor material, structure, or device, but aremerely idealized representations that are employed to describeembodiments of the present invention. Additionally, elements commonbetween figures may retain the same numerical designation.

As used herein, the term “III-V type semiconductor material” means andincludes any semiconductor material that is at least predominantlycomprised of one or more elements from group IIIA of the periodic table(B, Al, Ga, In, and Ti) and one or more elements from group VA of theperiodic table (N, P, As, Sb, and Bi).

As used herein, the term “II-VI type semiconductor material” means andincludes any semiconductor material that is at least predominantlycomprised of one or more elements from group IIB of the periodic table(Zn, Cd, and Hg) and one or more elements from group VIA of the periodictable (O, S, Se, Te, and Po).

As used herein, the term “coefficient of thermal expansion,” when usedwith respect to a material or structure, means the average linearcoefficient of thermal expansion of the material or structure at roomtemperature.

As used herein, the term “engineered substrate” means and includes anysubstrate that includes a relatively thin layer of semiconductormaterial (e.g., a layer having an average thickness of less than aboutthree hundred microns (300 μm)) disposed over (e.g., on) anothermaterial and that is intended to be used as a substrate for thefabrication of one or more semiconductor devices thereon. Engineeredsubstrates include, for example, semiconductor-on-insulator typesubstrates.

As used herein, the term “epitaxial layer of semiconductor material”means a layer of semiconductor material that is at least substantiallycomprised by a single crystal of the semiconductor material and that hasbeen formed such that the single crystal exhibits a knowncrystallographic orientation.

As used herein, the term “lattice strain,” when used with respect to alayer of crystalline material, means strain of the crystal lattice indirections at least substantially parallel to the plane of the layer ofmaterial. Similarly, the term “average lattice parameter,” when usedwith respect to a layer of material, means the average latticeparameters in dimensions at least substantially parallel to the plane ofthe layer of material.

As used herein, the term “reflow” means and includes heating orotherwise treating a material such that it is softened or has adecreased viscosity so that it may redistribute in space.

The term “relaxed,” when used in relation to a layer of material, meansand includes a layer of material that is at least substantially free oflattice strain. The term “relaxing” means reducing (e.g., relieving)lattice strain in a layer of material.

As used herein, the term “seed structure” means and includes any volumeof material comprising a crystal of semiconductor material that is usedas a substrate for growing or otherwise depositing additionalsemiconductor material thereon. Seed structures include, for example,seed layers, as well as structures formed by patterning seed layers, asdescribed in further detail hereinbelow.

Embodiments of the present invention include methods and structures thatfacilitate the epitaxial fabrication of relatively thick layers ofsemiconductor material (such as, for example, epitaxial layers of III-Vtype semiconductor materials) that have relatively lower concentrationsof defects therein, when compared to previously known, conventionalepitaxial layers of such semiconductor materials. Example embodiments ofmethods of fabricating semiconductor structures or devices that includesuch epitaxial layers of semiconductor material are described below withreference to the figures.

Referring to FIG. 1, a first intermediate structure 100 may befabricated or otherwise provided that includes a layer of substantiallyrelaxed semiconductor material 104. In other words, the layer ofsemiconductor material 104 may be at least substantially free of latticestrain at room temperature. A portion of the layer of semiconductormaterial 104 may be used to provide a seed layer on an engineeredsubstrate for use in forming one or more additional layers ofsemiconductor material thereon as part of the fabrication of an activesemiconductor device, as described in further detail below.

As shown in FIG. 1, in some embodiments, the layer of semiconductormaterial 104 may be attached to and carried by a sacrificial substrate102. In additional embodiments, however, the semiconductor material 104may comprise a free-standing, bulk layer of semiconductor material 104that is not disposed on or carried by a sacrificial substrate 102 or anyother material.

In some embodiments, the layer of semiconductor material 104 maycomprise an epitaxial layer of semiconductor material. By way of exampleand not limitation, the layer of semiconductor material 104 may comprisean epitaxial layer of III-V type semiconductor material. For example,the layer of semiconductor material 104 may comprise an epitaxial layerof gallium nitride (GaN).

The sacrificial substrate 102 may be at least substantially comprisedof, for example, aluminum oxide (Al₂O₃) (e.g., sapphire), zinc oxide(ZnO), silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs),lithium gallate (LiGaO₂), lithium aluminate (LiAlO₂), yttrium aluminumoxide (Y₃Al₅O₁₂), or magnesium oxide (MgO).

Optionally, one or more intermediate layers of material (not shown),such as another layer of semiconductor material, may be disposed betweenthe layer of semiconductor material 104 and the sacrificial substrate102. Such intermediate layers of material may be used, for example, as aseed layer for forming the layer of semiconductor material 104 thereon,or as a bonding layer for bonding the layer of semiconductor material104 to the sacrificial substrate 102, when it is difficult or impossibleto form the layer of semiconductor material 104 directly on thesacrificial substrate 102. In addition, bonding of the layer ofsemiconductor material 104 to the sacrificial substrate 102 may bedesired if semiconductor material 104 is polar. In such embodiments, thebonding process may be utilized to alter the polarity of the polarsemiconductor material. The figures are not shown to scale, and, inactuality, the layer of semiconductor material 104 may be relativelythin compared to the sacrificial substrate 102.

To form the intermediate structure 100 shown in FIG. 1, the layer ofsemiconductor material 104 may be epitaxially grown or otherwise formedor provided on a major surface of the sacrificial substrate 102. Any ofvarious methods known in the art may be used to reduce the density ofdislocations in the layer of semiconductor material 104 as the layer ofsemiconductor material 104 is formed on the sacrificial substrate 102.Such methods include, for example, epitaxial lateral overgrowth (ELO),pendeo-epitaxy, in-situ masking techniques, etc.

The sacrificial substrate 102 may exhibit a coefficient of thermalexpansion that differs from a coefficient of thermal expansion exhibitedby the layer of semiconductor material 104. For example, if thesacrificial substrate 102 exhibits a coefficient of thermal expansionthat is lower than the coefficient of thermal expansion exhibited by thelayer of semiconductor material 104, the crystal lattice of the layer ofsemiconductor material 104 may be in a state of compressive latticestrain upon heating the intermediate structure 100 to an elevatedtemperature, as atomic bonds between the sacrificial substrate 102 andthe layer of semiconductor material 104 may prevent the crystal latticeof the layer of semiconductor material 104 from expanding to equilibriumdimensions for the given elevated temperature. By equilibriumdimensions, it is meant the dimensions that would be exhibited by thelayer of semiconductor material 104 at a given temperature and pressureif it were not attached to the sacrificial substrate 102. If thesacrificial substrate 102 exhibits a coefficient of thermal expansionthat is higher than the coefficient of thermal expansion exhibited bythe layer of semiconductor material 104, the crystal lattice of thelayer of semiconductor material 104 may be in a state of tensile latticestrain upon heating the intermediate structure 100 to an elevatedtemperature, as atomic bonds between the sacrificial substrate 102 andthe layer of semiconductor material 104 may “stretch” the crystallattice of the layer of semiconductor material 104 beyond equilibriumdimensions for the given elevated temperature.

In additional embodiments, the intermediate structure of FIG. 1 may notinclude a sacrificial substrate 102, and may simply comprise afree-standing, bulk layer of semiconductor material 104. For example,bulk material 104 may comprise a free-standing gallium nitridesubstrate.

Referring to FIG. 2, a carrier substrate 112 may be bonded to the layerof semiconductor material 104 on a side thereof opposite the sacrificialsubstrate 102 using a glass bonding layer 114 to form anotherintermediate structure 110. Thus, the glass bonding layer 114 may bedisposed between the carrier substrate 112 and the layer ofsemiconductor material 104. The carrier substrate 112 and the layer ofsemiconductor material 104 may be bonded together by abutting the glassbonding layer 114 on the carrier substrate 112 against the layer ofsemiconductor material 104, and maintaining the resulting structure at adesired temperature and pressure for a sufficient amount of time inorder to produce a sufficient bonding strength between the adjoininglayers.

The carrier substrate 112 may exhibit a coefficient of thermal expansiongreater than a coefficient of thermal expansion exhibited by the layerof semiconductor material 104. As non-limiting examples, the carriersubstrate 112 may be at least substantially comprised of, for example,aluminum oxide (Al₂O₃) (e.g., sapphire), zinc oxide (ZnO), yttriumaluminum oxide (Y₃Al₅O₁₂), magnesium oxide (MgO), and metals or metalalloys such as HAYNES® Alloy 214 or HAYNES® Alloy 230.

The glass bonding layer 114 exhibits a glass transition temperature(T_(g)), below which the glass bonding layer 114 behaves in a brittlefashion, and above which the glass bonding layer 114 behaves in aductile fashion. By way of non-limiting example, the glass bonding layer114 may comprise at least one of an oxide glass, a phosphosilicate glass(PSG), a borosilicate glass (BSG), a borophosphosilicate glass (BPSG), apolyimide, a doped or undoped quasi-inorganic siloxane spin-on-glass(SOG), an inorganic spin-on-glass, and a doped or undoped silicateglass.

By way of example and not limitation, the glass bonding layer 114 mayhave a thickness in a range extending from about one-tenth of a micron(0.1 μm) to about ten microns (10 μm) and, more particularly, from aboutone micron (1 μm) to about five microns (5 μm).

Referring to FIG. 3, after bonding the carrier substrate 112 to thelayer of semiconductor material 104 using the glass bonding layer 114, aportion 104A of the layer of semiconductor material 104, together withthe carrier substrate 112, may be removed from the sacrificial substrate102 (or the sacrificial substrate 102 may be removed from the layer ofsemiconductor material 104) to form a third intermediate structure 120that includes a seed layer 104B formed from the portion 104A of thelayer of semiconductor material 104. By way of example and notlimitation, the process known in the industry as the SMARTCUT™ processmay be used to separate the portion 104A of the layer of semiconductormaterial 104 (and the carrier substrate 112) from the sacrificialsubstrate 102 and the remaining portion of the layer of semiconductormaterial 104. Such processes are described in detail in, for example,U.S. Pat. No. RE39,484 to Bruel (reissued Feb. 6, 2007), U.S. Pat. No.6,303,468 to Aspar et al. (issued Oct. 16, 2001), U.S. Pat. No.6,335,258 to Aspar et al. (issued Jan. 1, 2002), U.S. Pat. No. 6,756,286to Moriceau et al. (issued Jun. 29, 2004), U.S. Pat. No. 6,809,044 toAspar et al. (issued Oct. 26, 2004), and U.S. Pat. No. 6,946,365 toAspar et al. (issued Sep. 20, 2005), the disclosures of each of whichare incorporated herein in their entirety by this reference.

Briefly, referring again to FIG. 1, a plurality of ions (e.g., hydrogen,helium, or inert gas ions) may be implanted into the intermediatestructure 100. For example, ions may be implanted into the layer ofsemiconductor material 104 from an ion source (not shown) positioned ona side of the intermediate structure 100 adjacent the layer ofsemiconductor material 104. As represented by directional arrows 108shown in FIG. 1, ions may be implanted into the intermediate structure100 along a direction substantially perpendicular to the layer ofsemiconductor material 104. As known in the art, the depth at which theions are implanted into the intermediate structure 100 is at leastpartially a function of the energy with which the ions are implantedinto the intermediate structure 100. Generally, ions implanted with lessenergy will be implanted at relatively shallower depths, while ionsimplanted with higher energy will be implanted at relatively deeperdepths.

Ions may be implanted into the intermediate structure with apredetermined energy selected to implant the ions at a desired depth D₁within the intermediate structure 100 (e.g., within the layer ofsemiconductor material 104). As one particular non-limiting example, insome embodiments, an ion implant layer 109 may be disposed within thelayer of semiconductor material 104 at a depth D₁ in a range extendingfrom about one hundred nanometers (100 nm) to about three hundrednanometers (300 nm) below the exposed major surface of the layer ofsemiconductor material 104. As known in the art, inevitably at leastsome ions may be implanted at depths other than the desired implantationdepth D₁, and a graph of the concentration of the ions as a function ofdepth into the intermediate structure 100 from the exposed surface ofthe layer of semiconductor material 104 may exhibit a generallybell-shaped (symmetric or asymmetric) curve having a maximum at thedesired implantation depth D₁.

Upon implantation into the intermediate structure 100, the ions maydefine the ion implant layer 109 (illustrated as a dashed line inFIG. 1) within the intermediate structure 100. The ion implant layer 109may comprise a layer or region within the intermediate structure 100that is aligned with (e.g., centered about) the plane of maximum ionconcentration with the intermediate structure 100. The ion implant layer109 may define a zone of weakness within the intermediate structure 100along which the intermediate structure 100 may be cleaved or fracturedin a subsequent process, as described in further detail below.

In some embodiments of the present invention, the ion implant layer 109may be disposed in the layer of semiconductor material 104. In otherwords, the ion implant layer 109 may be disposed entirely within thelayer of semiconductor material 104. In additional embodiments, the ionimplant layer 109 may be disposed entirely within an intermediate layerof semiconductor material between the sacrificial substrate 102 and thelayer of semiconductor material 104, or partially within the layer ofsemiconductor material 104 and partially within an intermediate layer ofsemiconductor material.

After attaching the carrier substrate 112 to the layer of semiconductormaterial 104 on a side thereof opposite the sacrificial substrate 102 toform the intermediate structure 110, as previously described withreference to FIG. 2, the intermediate structure 110 may be subjected toone or more further treatments, such as, for example mechanical,chemical or thermal treatments, to cause the intermediate structure 110to cleave or fracture along the ion implant layer 109, thereby formingthe intermediate structure 120 shown in FIG. 3. In other words, theportion 104A of the layer of semiconductor material 104 may bedelaminated from the remaining portion of the layer of semiconductormaterial 104 and the underlying sacrificial substrate 102 upon, forexample, thermally treating the intermediate structure 110 to form theseed layer 104B. Additional semiconductor material may be grown on theseed layer 104B, as discussed in further detail below.

By way of example and not limitation, after attaching the carriersubstrate 112 to the layer of semiconductor material 104 to form theintermediate structure 110, the temperature of the intermediatestructure 110 may be maintained at an elevated temperature (i.e., aboveabout 100° C.) for an amount of time sufficient to cause the implantedions within the ion implant layer 109 to coalesce and form a pluralityof microcavities and/or inclusions. The elevated temperature at whichthis thermal treatment process is carried out may be at, below, or abovea temperature at which the carrier substrate 112 is attached to thelayer of semiconductor material 104. Furthermore, the dose of the ionimplantation process used to form the ion implant layer 109 (and, hence,the concentration of ions in the ion implant layer 109) may be tailoredsuch that the thermal budget (i.e., the heat input) required to causethe intermediate structure 110 to fracture along the ion implant layer109 is greater than the thermal budget required to bond the carriersubstrate 112 to the layer of semiconductor material 104 to ensure thatthe intermediate structure 110 does not fracture along the ion implantlayer 109 before the carrier substrate 112 is attached to the layer ofsemiconductor material 104.

In some embodiments of the present invention, after thermally treatingthe intermediate structure 110 (FIG. 2) to structurally weaken the ionimplant layer 109, splitting of the intermediate structure 110 along theion implant layer 109 may be initiated by changing a temperature of theintermediate structure 110. As the temperature of the intermediatestructure 110 is changed, differences in the coefficients of thermalexpansion of the sacrificial substrate 102 and the carrier substrate 112may result in the generation of stresses within the intermediatestructure 110 that will ultimately lead to fracture of the intermediatestructure 110 along the thermally treated ion implant layer 109. As anon-limiting example, splitting of the intermediate structure 110 alongthe ion implant layer 109 may be initiated as the intermediate structure110 is cooled (e.g., to room temperature) after thermally treating theintermediate structure 110 to structurally weaken the ion implant layer109.

Embodiments of the present invention are not limited to use of aSMARTCUT™ process for separating the portion 104A of the layer ofsemiconductor material 104 and the carrier substrate 112 from thesacrificial substrate 102 and the remaining portion of the layer ofsemiconductor material 104. In additional embodiments of methods of thepresent invention, other methods such as, for example, etchingprocesses, grinding processes, and laser lift-off processes may be usedto separate the portion 104A of the layer of semiconductor material 104and the carrier substrate 112 from the sacrificial substrate 102 and theremaining portion of the layer of semiconductor material 104.

The intermediate structure 120 shown in FIG. 3 optionally may be used asan engineered substrate, and an active device may be fabricated on theintermediate structure 120 by, for example, growing additional devicelayers of semiconductor material on and over the seed layer 104B. Asdiscussed in further detail below, the glass bonding layer 114 mayfacilitate relaxation of the seed layer 104B upon subsequent processing.

In some embodiments, prior to growing additional semiconductor materialon the seed layer 104B, the seed layer 104B may be patterned to form anintermediate structure 130 that includes a plurality of seed structures104C, as shown in FIGS. 4A and 4B, which may further assist in therelaxation of the semiconductor material of the seed layer 104B and theseed structures 104C upon subsequent processing. By way of example andnot limitation, the seed layer 104B (FIG. 3) may be patterned asdisclosed in provisional U.S. Patent Application Ser. No. 61/099,829,which was filed Sep. 24, 2008 and entitled Methods Of Forming RelaxedLayers Of Semiconductor Materials, Semiconductor Structures, Devices AndEngineered Substrates Including Same, and in provisional U.S. PatentApplication Ser. No. 61/109,784, which was filed Oct. 30, 2008 andentitled Methods Of Forming Layers Of Semiconductor Material HavingReduced Lattice Strain, Semiconductor Structures, Devices And EngineeredSubstrates Including Same, the disclosures of which are incorporatedherein in their entireties by this reference.

For example, masking and etching processes known in the art may be usedto pattern the seed layer 104B (FIG. 3) to form one or more seedstructures 104C (FIGS. 4A and 4B) from the seed layer 104B. Briefly, amask layer may be formed and processed (e.g., patterned) over the seedlayer 104B of the intermediate structure 120 of FIG. 3. The compositionand thickness of the mask layer may be selected based on the desiredetch depth and resistance with respect to underlying materials, such asthe seed layer 104B and the glass bonding layer 114. As a non-limitingexample, the mask layer may comprise a photoresist material or a hardmask material, such as an oxide material, a nitride material, or a metalmaterial (i.e., chromium or titanium). A plurality of apertures may beprovided through the mask layer to expose areas of the surface of theseed layer 104B to be etched through the mask layer.

A portion of the seed layer 104B may be removed through the apertures inthe mask layer using, for example, a dry etching process such asreactive ion etching, or a high density plasma etching process, such asinductively coupled plasma (ICP) etching. In addition, a wet chemicaletching process may also be utilized. For example, acidic or basic etchsolution processes may be utilized. Such processes are utilized to froma plurality of seed structures 104C, each comprising the semiconductormaterial of the seed layer 104B (and the layer of semiconductor material104). As a non-limiting example, in embodiments in which the seed layer104B comprises gallium nitride and the glass bonding layer 114 comprisesborophosphosilicate glass, the mask layer may comprise a photoresistmaterial, and a chlorine-based plasma etch process (e.g., ICP) may beused to remove the gallium nitride selective to the borophosphosilicateglass and the photoresist material to form seed structures 104Ccomprising gallium nitride. In other words, the gallium nitride may beremoved by the plasma at a rate that is significantly higher than therate or rates at which the plasma removes the borophosphosilicate glassand the photoresist material until the seed structures 104C are defined.After formation of the seed structures 104C, the remaining mask layermay be removed from the structure. In certain embodiments, the etchprocess, in addition to etching seed structures 104C, may also etchportions of the glass bonding layer 114 such that the plurality oftrenches formed in seed layer 104B may continue through the seed layer104B and into glass bonding layer 114.

Each of the seed structures 104C may comprise a volume of semiconductormaterial supported on and carried by the glass bonding layer 114, asshown in FIGS. 4A and 4B. By way of example and not limitation, the seedstructures 104C may be generally rectangular in shape, and may be formedto have lateral dimensions X and Y of between about five microns (5 μm)and about one millimeter (1 mm) (e.g., about five hundred microns (500μm)). Each seed structure 104C may be spaced from adjacent seedstructures 104C by a distance D₂ of between about one micron (1 μm) andabout one hundred microns (100 μm).

Referring to FIG. 5, another layer of semiconductor material 142 may beepitaxially grown over the seed structures 104C to form an intermediatestructure 140 as shown in FIG. 5. The seed structures 104C may serve astemplates for the epitaxial layer of semiconductor material 142 grownover the seed structures 104C. The epitaxial layer of semiconductormaterial 142 may include a single layer of semiconductor material ormultiple layers of semiconductor material. As a non-limiting example,the epitaxial layer of semiconductor material 142 may include a III-Vtype semiconductor material and the glass bonding layer 114 may beformed from a material that acts as an anti-surfactant to growth of theIII-V type semiconductor material of the layer of semiconductor material142. In other words, the material composition of the glass bonding layer114 may at least substantially prevent nucleation and growth of theIII-V nitride material thereon. As non-limiting examples, the layer ofsemiconductor material 142 may be GaN, or In_(y)Ga_(1-y)N, wherein yrepresents a number between 0.01 and 0.25, such as, for example, 0.05 or0.10.

The epitaxial layer of semiconductor material 142 may be deposited, forexample, using a high-temperature process, such as metalorganic chemicalvapor deposition (MOCVD), molecular beam epitaxy (MBE), or hydride vaporphase epitaxy (HVPE), and may be deposited at a temperature sufficientto decrease the viscosity of the glass bonding layer 114.

By way of non-limiting example, the epitaxial layer of semiconductormaterial 142 may be deposited at a temperature greater than or equal tothe glass transition temperature (T_(g)) of the glass bonding layer 114,at which point the viscosity of the glass bonding layer 114 may decreaseand allow the glass material of the glass bonding layer 114 to begin toreflow. The material composition of the glass bonding layer 114 may beselected so that it may be reflowed or otherwise softened at atemperature equal to or below the temperature at which the epitaxiallayer of semiconductor material 142 is deposited. As a non-limitingexample, the glass bonding layer 114 may comprise borophosphosilicateglass (BPSG) and the epitaxial layer of semiconductor material 142 maybe formed at a temperature determined based on the percentage content ofboron and phosphorous. More particularly, where the glass bonding layer114 is borophosphosilicate glass comprising 4% by weight boron and 4% byweight phosphorous, the glass bonding layer 114 may be exposed to atemperature of greater than about 600° C. during deposition of theepitaxial layer of semiconductor material 142. By heating the glassbonding layer 114 to a temperature sufficient to reflow the glassbonding layer 114 simultaneously with the deposition of the epitaxiallayer of semiconductor material 142 (e.g., a temperature above the glasstransition temperature T_(g) of the glass bonding layer 114), thecrystal lattices of the seed structures 104C, which are supported by andcarried on the glass bonding layer 114, may be allowed to at leastpartially relax and relieve lattice strain therein prior to or duringdeposition of the epitaxial layer of semiconductor material 142.

In some embodiments, the epitaxial layer of semiconductor material 142may comprise a material having a lattice constant substantially equal toa lattice constant of the semiconductor material of the seed structures104C. In addition, the seed structures 104C and the epitaxial layer ofsemiconductor material 142 may possess a mean coefficient of thermalexpansion that is less than that of the underlying intermediatestructure 130.

During the high temperature growth processes utilized to grow epitaxiallayer of semiconductor material 142, the tensile strain induced in theepitaxial semiconductor 142 due to the CTE mismatch with intermediatestructure 130 may be compensated for by the presence of the glassbonding layer 114, since the glass bonding layer 114 may reflow at theelevated growth temperatures. Therefore, the degree of tensile strain inthe seed structures 104C and the epitaxial layer of semiconductormaterial 142 may be decreased, thereby allowing the thickness of theepitaxial layer of semiconductor material 142 to be increased beyond thepoint at which defects and cracks may commonly form.

For example, consider the example where the seed structures 104C and theepitaxial layer of semiconductor material 142 each comprise galliumnitride, and the intermediate structure 130 comprises a BPSG glassbonding layer 114 and a sapphire carrier substrate 112. In this example,the mean CTE of the intermediate structure 130 is greater than that ofthe mean CTE of the seed structures 104C and the epitaxial layer ofsemiconductor material 142. As the temperature of the reactor isincreased to form epitaxial layer of semiconductor material 142, thegreater CTE of the sapphire carrier substrate 112 will begin to placethe overlying semiconductor material in a tensile strain state. However,as the temperature of the reactor passes the glass transitiontemperature of the BPSG glass bonding layer 114, the glass bonding layer114 will reflow, allowing the strain in the overlying semiconductorstructures (104C and 142) to reduce (i.e., allowing strain relaxation inthe semiconductor materials of the seed structures 104C and theepitaxial layer of semiconductor material 142).

In some embodiments, the epitaxial layer of semiconductor material 142may comprise a material having a lattice constant that is greater than alattice constant of the semiconductor material of the seed structures104C and, therefore, may result in a force being applied to the crystallattices of the seed structures 104C as the epitaxial layer ofsemiconductor material 142 is grown thereon. As the epitaxial layer ofsemiconductor material 142 is grown over the seed structures 104C whilethe glass bonding layer 114 is in a viscous and moveable state, thecrystal lattices may be allowed to expand or contract during growth ofthe epitaxial layer of semiconductor material 142 in response to anyforce applied to the crystal lattices of the seed structures 104C by thegrowing epitaxial layer of semiconductor material 142.

For example, where the seed structures 104C and the epitaxial layer ofsemiconductor material 142 each comprise indium gallium nitride, theepitaxial layer of semiconductor material 142 may have a higher indiumcontent in comparison to that of the seed structures 104C and, thus, alattice constant greater than a lattice constant of the semiconductormaterial of the seed structures 104C. The larger lattice constant of theepitaxial layer of semiconductor material 142 may create a force thatresults in a tensile strain within the underlying seed structures 104C.As the glass bonding layer 114 is in a viscous state, however, the atomsof the seed structures 104C are allowed to strain throughout thethickness T (FIG. 4A) of the seed structures 104C, thereby resulting inreduced stress within the seed structures 104C and the epitaxial layerof semiconductor material 142.

In contrast, in prior art methods in which the underlying materialsupporting and carrying a seed layer is not in a viscous state asanother layer of semiconductor material is epitaxially grown over theseed layer, the underlying material hinders movement of the atoms of theseed layer adjacent the underlying material, which may result in thegeneration of higher stresses within the seed layer and overlyinglayer(s) of semiconductor material, and increase the probability thatdefects will form within the seed layer and overlying layer(s) ofsemiconductor material.

Thus, in accordance with some embodiments of the present invention, theepitaxial layer of semiconductor material 142 formed as described hereinmay have a reduced number of defects therein for a given thickness andmaterial composition when compared to epitaxial layers of semiconductormaterial formed to have such a thickness and material composition usingmethods known in the art.

By depositing the epitaxial layer of semiconductor material 142 over theseed structures 104C while the glass bonding layer 114 is in a viscousstate (e.g., at a temperature above a glass transition temperature(T_(g)) of the glass material of the glass bonding layer 114), a strainbalance may be obtained between the epitaxial layer of semiconductormaterial 142 and the seed structures 104C that allows the layer ofsemiconductor material 142 to grow in an at least partially relaxedstate to relatively greater thickness with a reduced concentration ofdefects therein.

In some embodiments, the epitaxial layer of semiconductor material 142may be grown over the seed structures 104C to an average thickness ofabout two microns (2 μm) or more. In additional embodiments, theepitaxial layer of semiconductor material 142 may be grown over the seedstructures 104C to an average thickness of about six microns (6 μm) ormore. In some embodiments of the invention, the epitaxial layer ofsemiconductor material 142 may have an average thickness of greater thanabout two microns (2 μm) and less than about 50 microns (50 μm).

By way of non-limiting example, if the seed structures 104C, as shown inFIG. 5, each comprise gallium nitride and the glass bonding layer 114comprises borophosphosilicate glass, gallium nitride may be depositedover the seed structures 104C at or above a temperature at which theborophosphosilicate glass may be reflowed to allow expansion of thecrystal lattice of the seed structures 104C. In additional embodiments,the seed structures 104C and the epitaxial layer of semiconductormaterial 142 may comprise other materials, and the seed structures 104Cmay contract during formation of the epitaxial layer of semiconductormaterial 142 and reflow of the glass bonding layer 114.

Thus, the epitaxial layer of semiconductor material 142 may be depositedhaving a lattice structure that is relatively more relaxed. By formingthe epitaxial layer of semiconductor material 142 over the seedstructures 104C while simultaneously reflowing the glass bonding layer114 below the seed structures 104C, the epitaxial layer of semiconductormaterial 142 may be deposited above a critical thickness for theformation of defects thereof and, when comprised of InGaN, may include ahigher percentage of indium than can conventionally be deposited withoutdefect formation and phase separation.

In some embodiments, the epitaxial layer of semiconductor material 142may comprise gallium nitride. As a non-limiting example, the seedstructures 104C, as shown in FIG. 5, may also comprise GaN. Theepitaxial layer of GaN 142 may be deposited by metalorganic chemicalvapor deposition (MOCVD) at a temperature greater than about 600° C.and, more particularly, in a range extending from about 700° C. to about1150° C., while the glass bonding layer 114 comprises aborophosphosilicate glass having a glass transition temperature (T_(g))of about 700° C. or less and equal to or below the temperature at whichthe epitaxial layer of GaN 142 is deposited. In this way, the layer ofGaN may be deposited in an at least partially relaxed state, whichfacilitates formation of an at least partially relaxed layer having anincreased thickness, while reducing undesirable defects such asdislocations and cracks.

The carrier substrate 112 may comprise a material that exhibits acoefficient of thermal expansion that is greater than the coefficientsof thermal expansion of the seed structures 104C and the epitaxial layerof semiconductor material 142. Thus, upon cooling, after the temperatureof the intermediate structure 140 of FIG. 5 passes below the glasstransition temperature T_(g) of the glass bonding layer 114, the carriersubstrate 112 will shrink due to thermal contraction at a faster ratethan the seed structures 104C and the epitaxial layer of semiconductormaterial 142. As a result, the seed structures 104C and the epitaxiallayer of semiconductor material 142 may be placed in a state ofcompression upon cooling to room temperature. By providing the seedstructures 104C and the epitaxial layer of semiconductor material 142 ina state of compression, the probability that cracks and other defectsmay nucleate and propagate within the seed structures 104C and theepitaxial layer of semiconductor material 142 may be reduced.

Additional embodiments of the invention are described below withreference to FIGS. 6 through 8.

In accordance with additional embodiments of methods of the presentinvention, the intermediate structure 130 of FIGS. 4A and 4B may befabricated as previously described herein with reference to FIGS. 1through 4A and 4B.

After fabricating the intermediate structure 130 of FIGS. 4A and 4B, theintermediate structure 130 may be subjected to a thermal treatmentprocess. The intermediate structure 130 may be heated to a temperatureabove the glass transition temperature (T_(g)) of the glass bondinglayer 114 to allow the glass material of the glass bonding layer 114 toreflow, and the semiconductor material of the seed structures 104Cthereon to relax and relieve any lattice strain therein. Theintermediate structure 130 then may be allowed to cool, and as a resultof the carrier substrate 112 exhibiting a higher coefficient of thermalexpansion than the seed structures 104C, the thermal contraction of thecarrier substrate 112, upon cooling below the glass transitiontemperature (T_(g)) of the glass bonding layer 114 to room temperature,may result in the crystal lattices of the seed structures 104C beingplaced in a state of compressive strain at room temperature.

After subjecting the intermediate structure 130 of FIGS. 4A and 4B to athermal process to place the seed structures 104C in a state ofcompressive strain, the seed structures 104C may be transferred to asecond carrier substrate to effectively flip the seed structures 104Cupside down. Such a process may be desirable when seed structures 104Ccomprise polar semiconductor materials, as the flip process can reversethe polarity of the exposed major surface of the seed structures 104C.

Referring to FIG. 6, a second carrier substrate 152 may be bonded to theseed structures 104C of the intermediate structure 130 using anon-glassy bonding layer 154. The seed structures 104C may be disposedbetween and bonded to each of the glass bonding layer 114 and thenon-glassy bonding layer 154.

The second carrier substrate 152 may comprise a material that exhibits acoefficient of thermal expansion that is greater than a coefficient ofthermal expansion exhibited by the semiconductor material of the seedstructures 104C. By way of example and not limitation, the secondcarrier substrate 152 may be at least substantially comprised of any ofthe materials previously described in relation to the first carriersubstrate 112, including, for example, aluminum oxide (Al₂O₃) (e.g.,sapphire), zinc oxide (ZnO), yttrium aluminum oxide (Y₃Al₅O₁₂),magnesium oxide (MgO), and metals or metal alloys such as HAYNES® Alloy214 or HAYNES® Alloy 230.

In some embodiments, the second carrier substrate 152 may beelectrically conductive. For example, the carrier substrate 152 mayexhibit an electrical conductivity of about 100 (ohm-cm)⁻¹ or more atroom temperature. Furthermore, the carrier substrate 152 may bethermally conductive. For example, the carrier substrate 152 may exhibita thermal conductivity of about 100 W/mK or more at room temperature.

The non-glassy bonding layer 154 may comprise, for example, at least oneof an oxide material and a nitride material (e.g., SiO₂, Si₃N₄, orSiO_(x)N_(y)). In embodiments in which the carrier substrate 152 iselectrically and thermally conductive, as discussed above, thenon-glassy bonding layer 154 may comprise a metallic bonding layer(i.e., a layer of metal or metal alloy material). In addition, inembodiments in which the carrier substrate 152 is electrically andthermally conductive, the non-glassy bonding layer 154 may have athickness of less than approximately 100 nm, such that the non-glassybonding layer 154 may not have a detrimental effect on the overallthermal and electrical properties. Such embodiments may find particularutility for use in semiconductor devices that operate at relatively highpowers and/or temperatures.

The second carrier substrate 152 and the seed structures 104C may bebonded together by abutting the non-glassy bonding layer 154 on thesecond carrier substrate 152 against the seed structures 104C, andmaintaining a resulting intermediate structure 150 at a desiredtemperature and pressure for a sufficient amount of time in order toproduce a sufficient bonding strength between the adjoining layers.

After attaching the second carrier substrate 152 to the seed structures104C of the intermediate structure 130 using the non-glassy bondinglayer 154, the first carrier substrate 112 and the glass bonding layer114 may be separated or otherwise removed from the seed structures 104C,which remain bonded to the second carrier substrate 152 by thenon-glassy bonding layer 154, to form an intermediate structure 160shown in FIG. 7.

By way of example and not limitation, a laser lift-off process may beused to remove the first carrier substrate 112 from the seed structures104C. Such a laser lift-off process may remove the first carriersubstrate 112 in a non-destructive manner, and, therefore, first carriersubstrate 112 may be recycled for additional growth processes. Anetching process, a chemical-mechanical polishing (CMP) process, or acombination of such processes may be used as desirable to remove anyremaining portion of the glass bonding layer 114 on the seed structures104C.

Referring to FIG. 8, after removing the first carrier substrate 112 andthe glass bonding layer 114 from the seed structures 104C, another layerof semiconductor material 142 may be epitaxially grown over the seedstructures 104C as previously discussed in relation to FIG. 5 to form anintermediate structure 170 as shown in FIG. 8.

In the embodiment of FIG. 8, however, the non-glassy bonding layer 154does not soften or reflow at temperatures at which the epitaxial layerof semiconductor material 142 is grown over the seed structures 104C.The non-glassy bonding layer 154 may not exhibit a glass transitiontemperature (Tg), or may exhibit a glass transition temperature (Tg)that is greater than a temperature at which the epitaxial layer ofsemiconductor material 142 is grown over the seed structures 104C. Thus,in the embodiment of FIG. 8, as the intermediate structure 160 (FIG. 7)is heated to the temperature at which the epitaxial layer ofsemiconductor material 142 is to be grown over the seed structures 104C,the thermal expansion of the second carrier substrate 152, whichexhibits a higher coefficient of thermal expansion than the seedstructures 104C, may cause the crystal lattices of the seed structures104C to expand or “stretch” in lateral directions parallel to the planeof the generally planar carrier substrate 152.

As previously mentioned, however, the seed structures 104C initially maybe in a state of compression at room temperature. The degree ofcompressive strain in the seed structures 104C may be increased beyondthat commonly found in the prior art due to the thermal treatmentutilized to substantially relax the tensile strain in the seedstructures 104C at elevated temperature. Since the tensile strain isreduced via relaxation at elevated temperature, when the seed structures104C are cooled, the greater CTE of the carrier substrate 112 may placethe seed structures 104C under an increased degree of compressivestrain. Thus, depending upon the ultimate temperature at which theepitaxial layer of semiconductor material 142 is to be grown over theseed structures 104C, the seed structures 104C may remain in a state ofcompression (although reduced relative to that at room temperature, theseed structures 104C may be relaxed (i.e., the seed structures 104C maynot be in a state of compression or tension), or the seed structures104C may be in a state of tension.

In some embodiments, the material compositions of the seed structures104C, the carrier substrate 154, and the non-glassy bonding layer 154,as well as the temperature at which the carrier substrate 154 is bondedto the seed structures 104C and the temperature at which the epitaxiallayer of semiconductor material 142 is grown over the seed structures104C (and any other pertinent process parameters) may be selected tocause the seed structures 104C to be in a relaxed state while theepitaxial layer of semiconductor material 142 is grown over the seedstructures 104C. In other embodiments, they may be selected to cause theseed structures 104C to be in a state of compression, or in a state oftension, while the epitaxial layer of semiconductor material 142 isgrown over the seed structures 104C.

After the epitaxial layer of semiconductor material 142 is grown overthe seed structures 104C, upon cool down to room temperature, theepitaxial layer of semiconductor material 142 and the seed structures104C may be in a state of compression caused by the thermal contractionof the carrier substrate 154, to which they are attached by thenon-glassy bonding layer 154, as the carrier substrate 154 willthermally contract at a rate greater than that at which the epitaxiallayer of semiconductor material 142 and the seed structures 104Cthermally contract due to the higher coefficient of thermal expansion(and thermal contraction) of the carrier substrate 154.

As a result of the crystal lattices of the seed structures 104C and thelayer of semiconductor material 142 being placed in a state ofcompressive strain, the probability that cracks and other defects maynucleate and propagate within the seed structures 104C and the epitaxiallayer of semiconductor material 142 may be reduced.

Although embodiments of the present invention have been primarilydescribed herein with reference to semiconductor materials comprisinggallium nitride and indium gallium nitride, the present invention is notso limited, and embodiments of the present invention may be used toprovide layers of other III-V type semiconductor materials (e.g., GaAs,InP, AlGaN, etc.), layers of II-VI type semiconductor materials, layersof silicon, layers of germanium, layers of silicon carbide (SiC), etc.

While the present invention has been described herein with respect tocertain embodiments, those of ordinary skill in the art will recognizeand appreciate that it is not so limited. Rather, many additions,deletions, and modifications to the embodiments described herein may bemade without departing from the scope of the invention as hereinafterclaimed. In addition, features from one embodiment may be combined withfeatures of another embodiment while still being encompassed within thescope of the invention as contemplated by the inventors.

What is claimed is:
 1. A method of fabricating a semiconductor structureor device, comprising: bonding at least one seed structure at leastsubstantially comprised by a single crystal of semiconductor material toa carrier substrate using a glass bonding layer; selecting the carriersubstrate to comprise a material that exhibits a coefficient of thermalexpansion higher than a coefficient of thermal expansion exhibited bythe single crystal of semiconductor material of the at least one seedstructure; depositing at least one layer of semiconductor material overthe at least one seed structure at a temperature above a glasstransition temperature of a glass material of the glass bonding layerwhile the at least one seed structure is supported on the glass bondinglayer; cooling the at least one layer of semiconductor material, the atleast one seed structure, the glass bonding layer, and the carriersubstrate to room temperature after depositing the at least one layer ofsemiconductor material over the at least one seed structure; andcompressively straining the single crystal of semiconductor material ofthe at least one seed structure using thermal contraction of the carriersubstrate while cooling the at least one layer of semiconductormaterial, the at least one seed structure, the glass bonding layer, andthe carrier substrate to room temperature from a temperature below theglass transition temperature of the glass material of the glass bondinglayer.
 2. The method of claim 1, wherein bonding the at least one seedstructure to the carrier substrate using the glass bonding layercomprises bonding an at least substantially continuous seed layer to thecarrier substrate using the glass bonding layer.
 3. The method of claim1, wherein bonding the at least one seed structure to the carriersubstrate using the glass bonding layer comprises: patterning an atleast substantially continuous seed layer to form a plurality of seedstructures; and bonding the plurality of seed structures to the carriersubstrate using the glass bonding layer.
 4. The method of claim 1,further comprising selecting the single crystal of semiconductormaterial of the at least one seed structure to comprise a III-V typesemiconductor material.
 5. The method of claim 1, wherein depositing theat least one layer of semiconductor material over the at least one seedstructure comprises epitaxially growing a layer of III-V typesemiconductor material on the at least one seed structure to a thicknessof about two microns (2 μm) or more.
 6. The method of claim 1, furthercomprising selecting the glass bonding layer to comprise aborophosphosilicate glass (BPSG).
 7. The method of claim 1, furthercomprising fabricating at least one of a light-emitting diode, a laser,an optical sensor, a power electronic device and a solar cell comprisingthe at least one layer of semiconductor material.
 8. A method offabricating a semiconductor structure or device, comprising: bonding atleast one seed structure at least substantially comprised by a singlecrystal of semiconductor material to a first carrier substrate using aglass bonding layer; bonding a second carrier substrate to the at leastone seed structure on a side thereof opposite the first carriersubstrate using a non-glassy bonding layer; removing the first carriersubstrate and the glass bonding layer from the at least one seedstructure; expanding the single crystal of semiconductor material of theat least one seed structure using thermal expansion of the secondcarrier substrate while heating the at least one seed structure, thenon-glassy bonding layer, and the second carrier substrate; anddepositing at least one layer of semiconductor material over the atleast one seed structure on a side thereof opposite the second carriersubstrate and the non-glassy bonding layer while the single crystal ofsemiconductor material is in an expanded state at least partially causedby the thermal expansion of the second carrier substrate.
 9. The methodof claim 8, further comprising: heating the at least one seed structure,the glass bonding layer and the first carrier substrate; relaxing thestrain in the at least one seed structure; and compressively strainingthe single crystal of semiconductor material of the at least one seedstructure using thermal contraction of the first carrier substrate whilecooling the at least one layer of semiconductor material, the at leastone seed structure, the glass bonding layer, and the first carriersubstrate to room temperature from a temperature below the glasstransition temperature of the glass material of the glass bonding layer.10. The method of claim 8, further comprising: selecting the secondcarrier substrate to comprise a material that exhibits a coefficient ofthermal expansion higher than a coefficient of thermal expansionexhibited by the single crystal of semiconductor material of the atleast one seed structure; cooling the at least one layer ofsemiconductor material, the at least one seed structure, the non-glassybonding layer, and the second carrier substrate to room temperatureafter depositing the at least one layer of semiconductor material overthe at least one seed structure; and compressively straining the singlecrystal of semiconductor material of the at least one seed structure andthe at least one layer of semiconductor material using thermalcontraction of the second carrier substrate while cooling the at leastone layer of semiconductor material, the at least one seed structure,the non-glassy bonding layer, and the second carrier substrate to roomtemperature from a temperature at which the at least one layer ofsemiconductor material is deposited over the at least one seedstructure.
 11. The method of claim 8, wherein bonding the at least oneseed structure to the first carrier substrate using the glass bondinglayer comprises: patterning an at least substantially continuous seedlayer to form a plurality of seed structures; and bonding the pluralityof seed structures to the first carrier substrate using the glassbonding layer.
 12. The method of claim 8, further comprising selectingthe single crystal of semiconductor material of the at least one seedstructure to comprise a III-V type semiconductor material.
 13. Themethod of claim 12, wherein depositing the at least one layer ofsemiconductor material over the at least one seed structure comprisesepitaxially growing a layer of III-V type semiconductor material on theat least one seed structure to a thickness of about two microns (2 μm)or more.
 14. The method of claim 8, further comprising: selecting theglass bonding layer to comprise a borophosphosilicate glass (BPSG); andselecting the non-glassy bonding layer to comprise at least one of SiO₂,Si₃N₄, and SiO_(x)N_(y), wherein x and y are any numbers having a sumapproximately equal to two (2).
 15. The method of claim 8, furthercomprising: selecting the second carrier substrate to comprise anelectrically and thermally conductive material; and selecting thenon-glassy bonding layer to comprise a metal or metal alloy material.16. The method of claim 8, further comprising fabricating at least oneof a light-emitting diode, a laser, an optical sensor, a powerelectronic device and a solar cell comprising the at least one layer ofsemiconductor material.